Barang | Kamampuhan produksi masal | Kamampuhan prototyping |
| Lapisan | 1-20 | 1-28 |
| Bahan dasar | FR-4, Frékuénsi luhur |
| Ukuran maksimum | 500mm × 600mm | 580mm × 800mm |
| Akurasi diménsi | ± 0,13 mm | ± 0,1 mm |
| Rentang kandel | 0,20-4,00 mm | 0.20-6.00mm |
| Kasabaran ketebalan (THK≥0.8mm) | ± 8% | ± 8% |
| Kasabaran ketebalan (THK <0.8mm) | ± 10% | ± 10% |
| ketebalan diéléktrik | 0,07-3,20 mm | 0.07-5.00mm |
| Lebar garis minimum | 0,1 mm | 0,075 mm |
| spasi minimum | 0,1 mm | 0,075 mm |
| Ketebalan tambaga luar | 37-175um | 35-280um |
| ketebalan tambaga batin | 17-175um | 17-280um |
| Lubang bor (mékanis) | 0,15-6,35 mm | 0,15-6,35 mm |
| Réngsé liang (mékanis) | 0,10-6,30 mm | 0,10-6,30 mm |
| Toleransi diaméterna (mékanis) | ± 0,075 mm | ± 0,075 mm |
| Toleransi posisi liang (mékanis) | ± 0,05 mm | ± 0,05 mm |
| Babandingan aspék | 10:01 | 13:01 |
| Jenis topeng solder | LPI | LPI |
| Lebar sasak topeng solder minimum | 0,1 mm | 0,08 mm |
| Clearance masker solder minimum | 0,075 mm | 0,05 mm |
| Diaméter liang colokan | 0,25-0,50 mm | 0,25-0,60 mm |
| kasabaran kontrol impedansi | ± 10% | ± 10% |
| Beungeut bérés | HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Emas Ramo |
